Patent Number 8871355
Composites that include a metal injection molded component bonded to a support substrate and methods for forming the composites are described. Methods include forming a metal injection molded green part that includes microstructures on a surface of the green part. The metal injection molded component is located adjacent to a support substrate with the microstructure ends contacting the support substrate at a contact surface. During sintering the metal injection molded component is bonded to the support substrate at the ends of the microstructures. The presence of the microstructures can allow for relative motion between the metal injection molded component and the support substrate during sintering. The large bonding surface area provided by the multiple points of contact between the ends of the microstructures and the support substrate can provide excellent bonding force between the metal injection molded component and the support substrate.
Clemson University (Clemson, SC)
October 10, 2011
428/533; 428/594; 419/8; 419/38