Document Type
Patent
Publication Date
11-6-2012
Patent Number
patent number 8304854
Abstract
Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.
Application Number
12/270457
Assignees
Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR); Clemson University (Clemson, SC, US)
Filing Date
2008-11-13
Primary/U.S. Class
257/532
Other/U.S. Class
257/535, 257/E23.057, 257/E29.343, 361/301.1, 361/306.1, 361/306.2, 361/306.3, 361/307, 361/308.1, 361/310, 361/734, 361/738