Date of Award
Master of Science (MS)
School of Materials Science and Engineering
Igor A. Luzinov
Stephen H. Foulger
Olin T. Mefford
Polyether ether ketone (PEEK) is widely regarded as a high-performance thermoplastic material due to its desirable properties, including a high strength to weight ratio and excellent chemical stability. However, a practical challenge to working with PEEK is that its chemical resistance and inertness make the adhesion of functional coatings to PEEK surfaces quite difficult. To this end, we have developed a method for promoting adhesion between PEEK and a thermoset epoxy coating by introducing a reactive and mechanically robust polymer layer at the interface, which bonds with both the substrate and the coating.
Our process involves pre-treatment of PEEK using mechanical abrasion and an environmentally friendly chemical etchant capable of increasing reactivity/polarity. This process introduces oxygen-containing functional groups at the surface that act as anchor points for the polymer interlayer. Polyglycidyl methacrylate (PGMA) and various PGMA-based copolymers were selected as interlayer materials due to their multiple epoxy functionality and are applied to the PEEK surface via dip coating. The interlayer swells and co-cures within the epoxy resin as it is used, forming strong bonds with both the substrate and the epoxy coating. The result is a significant increase in adhesive strength when compared to the untreated PEEK-epoxy interface.
Rozelsky, Eric Charles, "Thermoplastic-Thermoset Bonding via Reactive Interfaces" (2021). All Theses. 3616.